DOUBLE PLATED CONDUCTIVE PILLAR PACKAGE SUBSATRATE

摘要

The present disclosure relates to a package substrate. The package substrate includes a patterned conductive layer and conductive pillars. Each of the conductive pillars includes a first portion and a second portion, where the first portion contacts the patterned conductive layer at one end of the first portion, and the second portion is adjacent to another end of the first portion. A thickness of the first portion is greater than a thickness of the second portion. Side surfaces of the first portion are substantially coplanar to side surfaces of the second portion.

主权项

1. A package substrate, comprising:
a patterned conductive layer; and a plurality of conductive pillars, wherein each of the conductive pillars includes:
a first portion, having a first thickness, with one end contacting the patterned conductive layer, anda second portion, having a second thickness that is less than the first thickness, adjacent to another end of the first portion, the second portion including a first sub-portion and a second sub-portion, wherein the second portion includes corners between the first sub-portion and the second sub-portion; wherein side surfaces of the first portion are substantially coplanar to side surfaces of the second portion.