| 摘要 |
PROBLEM TO BE SOLVED: To increase the inductance of an inductor formed on a semiconductor substrate.SOLUTION: A core formed on another substrate is inserted into the coil center hole of coil wiring formed on a semiconductor substrate and consisting of at least one layer. After fixing the core in the coil center hole, the another substrate is separated. The core is patterned by attaching a thin plate of a core material (magnetic substance) to the another substrate via a joining material. The coil center hole formed in the semiconductor substrate is filled with a liquidity adhesive agent, and the liquidity adhesive agent hardens after the core is inserted thus fixing the core. After the core is fixed, adhesive strength of the joining material is lowered and the another substrate is separated. Since the core material has a permeability as high as the bulk permeability, an inductor having a very large inductance can be formed. |
