MULTICHIP PACKAGE HAVING EXPOSED COMMON PAD

摘要

PROBLEM TO BE SOLVED: To obtain a multichip package in which each chip can be tested at the package level without having any intra test circuit by connecting a plurality of lead wires for transmitting the data I/O signal of respective semiconductor chips through common pads. SOLUTION: A control signal for driving semiconductor memory chips 14, 16 is fed from a microchip 18 through a lead wire 10 on a substrate 12. Lead wires for storing a specific data from the microchip 18 into the memory chips 14, 16 or reading out data value therefrom are connected through common pads 20. More specifically, lead wires for transmitting the I/O data signal of respective chips 14, 16, 18 are provided in a conductive pattern and interconnected through the common pads. Connection state of data is checked by delivering an initial signal from a microchip 18 and driving the memory chips 14, 16, through the common pads 20 connected with I/O pins.