发明名称 |
Semiconductor plating system workpiece support having workpiece engaging electrodes with distal contact part and dielectric cover |
摘要 |
A semiconductor workpiece holder used in electroplating systems for plating metal layers onto a semiconductor workpieces, and is of particular advantage in connection with plating copper onto semiconductor materials. The workpiece holder includes electrode assemblies which have a contact part which connects to a distal end of an electrode shaft and bears against the workpiece and conducts current therebetween. The contact part is preferably made from a corrosion resistant material, such as platinum. The electrode assembly also preferably includes a dielectric layer which covers the distal end of the electrode shaft and seals against the contact part to prevent plating liquid from corroding the joint between these parts.
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申请公布号 |
US5985126(A) |
申请公布日期 |
1999.11.16 |
申请号 |
US19970988333 |
申请日期 |
1997.09.30 |
申请人 |
SEMITOOL, INC. |
发明人 |
BLECK, MARTIN C.;GRAHAM, LYNDON W.;HANSON, KYLE M. |
分类号 |
H01L21/687;(IPC1-7):C25D7/12;C25D17/06 |
主分类号 |
H01L21/687 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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