发明名称 |
Multiple size wafer vacuum chuck |
摘要 |
A vacuum holding chuck is presented. The vacuum holding chuck of the present invention is particularly well suited for holding semiconductor wafers of multiple diameters during various testing and manufacturing operations. In an exemplary embodiment, the vacuum chuck comprises a body having a first surface and an opposing second surface, wherein the first surface includes first and second recessed circular platforms to receive wafers having first and second diameters, respectively. The second surface includes at least one recessed circular platform to receive a wafer having a third diameter. Each circular platform is defined at least in part by an annular shoulder and each circular platform further includes a vacuum trough which is connected to a vacuum source which when activated, evacuates the air from the vacuum trough and securely holds a wafer in place within the circular platform.
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申请公布号 |
US6164633(A) |
申请公布日期 |
2000.12.26 |
申请号 |
US19990315380 |
申请日期 |
1999.05.18 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
MULLIGAN, VINCENT P.;TOMPKINS, JR., CHARLES R.;YUEN, WING FUNG |
分类号 |
B25B11/00;H01L21/683;(IPC1-7):B25B11/00 |
主分类号 |
B25B11/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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