| 摘要 |
PROBLEM TO BE SOLVED: To miniaturize an optical reception module where a photodetector, a preamplifier, and a bypass capacitor are mounted into a package, for simplifying the manufacturing processes and reducing the manufacturing cost. SOLUTION: A parallel plate capacitor 2 is mounted to the center of a package 1, and a photodetector chip 3 is placed on the capacitor to be fixed. The capacitor 2 and the photodetector 3 are piled up on each other, thus reducing the area for mounting the photodetector 3. Since a spacer for the capacitor is dispensed with, processes are simplified, the number of parts are reduced, and hence a compact optical reception module is obtained. |
