| 发明名称 |
Methods of forming electronic and optical components using laser ablation |
| 摘要 |
<p>Provided are methods of forming an electronic and/or optical component. The methods involve: (a) providing an electronic substrate having a polymeric layer, wherein the polymeric layer includes a polymer with units of the formula (R<1>SiO1.5), wherein R<1> is a substituted or unsubstituted organic group; and (b) removing selected portions of the polymeric layer by laser ablation. The invention has particular applicability in the electronics and optoelectronics industries. <IMAGE></p> |
| 申请公布号 |
EP1550888(A1) |
申请公布日期 |
2005.07.06 |
| 申请号 |
EP20040257942 |
申请日期 |
2004.12.18 |
| 申请人 |
ROHM AND HAAS ELECTRONIC MATERIALS, L.L.C. |
发明人 |
MOYNIHAN, MATTHEW L.;COLANGELO, CARL J.;SHELNUT, JAMES G.;SICARD, BRUNO M.;PUGLIANO, NICOLA |
| 分类号 |
G02B6/12;B23K26/00;B23K26/40;G02B6/02;G02B6/122;G02B6/13;G02B6/132;G02B6/136;G02B6/36;G02B6/42;G02B6/43;H05K1/02;H05K3/00;(IPC1-7):G02B6/122 |
主分类号 |
G02B6/12 |
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