| 摘要 |
A multi-chip package is provided to prevent an increase of the width of a package by stacking semiconductor chips using only bumps, without using a bonding wire. A first dummy double-pattern die(250a) is positioned on a PCB. First and second semiconductor chips(210,220) are attached to bottom and upper surfaces of the first dummy double-pattern die. A circuit pattern of the first dummy double pattern die is electrically connected to the PCB by a first bump(260a). A second dummy double-pattern die(250b) is positioned on the first dummy double-pattern die. Third and fourth semiconductor chips(230,240) are attached to bottom and upper surfaces of the first dummy double-pattern die. A circuit pattern of the second dummy double pattern die is electrically connected to the circuit pattern of the first dummy double-pattern die by a second bump(260b). A solder ball(280) is formed on the bottom surface of the PCB. |
