| 摘要 |
<p>In a method and system for fabricating a full wafer (600) having dies, an orientation marker (606), and a reference die, includes configuring a reticle pattern (602) that is configured by arranging the dies in an array having m rows and n columns, where the m rows start in a row adjacent to the orientation marker, and m and n are integers. The reticle pattern is transferred to the full wafer to sequentially form a portion of the dies. The transferring includes placing an inkless marker in the form of one or more non-circuit dies between the n columns of adjacent reticle patterns. The reticle pattern is repeatedly transferred to form a remaining portion of the dies to complete the full wafer. A wafer map for the full wafer is stored, with the wafer map including a non-circuit bin containing data describing the inkless marker.</p> |
