| 摘要 |
A device for separating an electrostatic chuck of a semiconductor device manufacturing apparatus is provided to easily separate an electrostatic chuck without damage and to minimize occurrence of particles polluting a wafer or an inside of a process chamber. A device for separating an electrostatic chuck of a semiconductor device manufacturing apparatus includes a frame portion(202), a plurality of screws(204a,204b,204c,204d,204e), and a handle portion(206). The frame portion is positioned on an electrostatic chuck. The electrostatic chuck has a sealing plate and an electrostatic chuck plate. The plurality of screws are formed in the frame portion to be inserted into screw fixing holes formed between the sealing plate and the electrostatic plate of the electrostatic chuck. The handle portion is formed in a center part of the frame portion, and lifts the electrostatic chuck plate separated from the sealing plate of the electrostatic chuck. The frame portion has an H shape. Eight screw fixing holes are formed in the electrostatic chuck.
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