| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic part having high reliability and a manufacturing method for the electronic part. SOLUTION: The electronic part has a package substrate 20 formed of ceramic, a device chip 10 loaded on the package substrate 20 and a solder-plating film 30 for hermetic sealing formed between the package substrate 20 and the device chip 10. The solder-plating film has a base 36 formed of a resin and a solder layer 38 coating the whole base. The solder-plating film 30 is brought into contact with the outer-peripheral surface of the device chip 10 and the outer-peripheral surface of the package substrate 20. COPYRIGHT: (C)2006,JPO&NCIPI |
