| 摘要 |
PROBLEM TO BE SOLVED: To provide a Co-Si-based copper alloy sheet which has excellent solder wettability and in which formation of pinholes is less likely to occur in soldering.SOLUTION: The Co-Si-based copper alloy sheet contains 0.5 to 3.0 mass% of Co and 0.1 to 1.6 mass% of Si, and further contains >2.0 and ≤4.0 mass% of one or more selected from the group consisting of Mn, Fe, Mg, Ni, Cr, V, Nb, Mo, Zr, B, Ag, Be, Zn, Sn, mish metal, and P, with the remainder being Cu and unavoidable impurities, and satisfies the following relationship: {(60 degrees specular glossiness G in the direction parallel to the rolling direction (RD))-(60 degrees specular glossiness G in direction orthogonal to rolling direction (TD))} ≥90%. |
