Method and Apparatus for Image Sensor Packaging

摘要

A device having a sensor die with a sensor and a control circuit die with at least one control circuit disposed therein, the control circuit die on the sensor die. A plurality of mounting pads is disposed on a second side of the sensor die. A first electrical connection connects a first one of the plurality of mounting pads to a first control circuit of the at least one sensor control circuit and a second electrical connection connects the first control circuit to the sensor. A third electrical connection connects the sensor to a second control circuit of the at least one control circuit and a fourth electrical connection connects the second control circuit to second one of the plurality of mounting pads.

主权项

1. A device comprising:
a pixel array disposed in a sensor die and configured to sense light though a back side of the sensor die; mounting pads disposed in a control circuit die; a first control circuit disposed on the control circuit die, the control circuit die bonded to a front side of the sensor die, the first control circuit electrically connected to at least one of the mounting pads and configured to receive an input signal from at least one of the mounting pads; a second control circuit disposed on the control circuit die, the second control circuit electrically connected to at least one of the mounting pads and configured to transmit an output signal through at least one of the mounting pads; a first electrical connection connecting the first control circuit to the pixel array, wherein the first control circuit is configured to send a control signal to the pixel array over the first electrical connection; and a second electrical connection connecting the second control circuit to the pixel array, wherein the second control circuit is configured to receive a data signal from the pixel array over the first electrical connection.