| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin sealing mold capable of sealing a mounting body, that can be formed by a simple structure, along with an electronic component, and to provide a resin sealing device and a method of manufacturing a molding.SOLUTION: A resin sealing device 1000 includes a resin sealing mold 40 having an upper mold 20 and a lower mold 30, where a semiconductor element mounted on a printed wiring board is arranged in a cavity formed by mold closing, and sealing resin is injected into the cavity, thus sealing the semiconductor element. A suction hole 212 for sucking a heat sink 130, to be mounted on the semiconductor element, is formed in the suction block 210 of the upper mold 20 of the sealing mold 40. The heat sink 130 is sucked by this suction hole 212, and arranged in noncontact state with a printed wiring board, thus forming a space, into which the sealing resin is injected, between the heat sink 130 and the semiconductor element.SELECTED DRAWING: Figure 1 |
