| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring board manufacturing method which achieves easy manufacturing of a wiring board and has high reliability.SOLUTION: A wiring board manufacturing method comprises: a first process of forming a wiring part with a wiring layer on a first surface of a resin film which has the first surface and the second surface and has heat resistance and electrical insulation; a second process of adhering a first support substrate on the wiring part via a first adhesion layer; a third process of forming a through electrode which pierces the resin film from the second surface side of the resin film to be connected with the wiring layer; and a fourth process of arranging on the second surface of the resin film, a first substrate to be connected with the through electrode.SELECTED DRAWING: Figure 22 |
