| 发明名称 |
SEMICONDUCTOR MANUFACTURING APPARATUS |
| 摘要 |
A semiconductor manufacturing apparatus according to an embodiment comprises a container contains a mixed solution that includes a processing solution for plating processing of a substrate and an additive and being capable of draining a part of the mixed solution when a first condition is satisfied. A first supplier supplies the processing solution to the container. A second supplier supplies the additive to the container when the first condition is satisfied and drainage of a part of the mixed solution is finished. |
| 申请公布号 |
US2016362793(A1) |
申请公布日期 |
2016.12.15 |
| 申请号 |
US201514847374 |
申请日期 |
2015.09.08 |
| 申请人 |
KABUSHIKI KAISHA TOSHIBA |
发明人 |
IZUMI Takashi;IKEGAYA Fumitoshi |
| 分类号 |
C23C18/16 |
主分类号 |
C23C18/16 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A semiconductor manufacturing apparatus comprising:
a container containing a mixed solution that includes a processing solution for plating processing of a substrate and an additive, the container being capable of draining a part of the mixed solution when a first condition is satisfied; a first supplier supplying the processing solution to the container; and a second supplier supplying the additive to the container when the first condition is satisfied and drainage of a part of the mixed solution is finished. |
| 地址 |
Minato-ku JP |
