发明名称 LOGIC DEVICE AND SEMICONDUCTOR PACKAGE HAVING THE SAME
摘要 PURPOSE: A logic device and a semiconductor package having the same are provided to perform various functions by reconfiguring individual reconfiguration of a function block and connection block. CONSTITUTION: An electronic circuit module(1) includes a logic device(10) having multiple logic blocks(11,12,13,14) and an external memory(15). The logic device consists of a programmable logic device by a user. The external memory stores connection information of wires between multiple logic blocks included in the logic device. Connection information of wires stored in an external memory is loaded in a logic device. The function of a logic device is defined based on connection relations of multiple logic blocks. [Reference numerals] (11) First logic block; (12) Second logic block; (13) Third logic block; (14) Fourth logic block; (15) External memory
申请公布号 KR20130006941(A) 申请公布日期 2013.01.18
申请号 KR20110062480 申请日期 2011.06.27
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 KIM, HO JUNG;SHIN, JAI KWANG;CHOI, HYUN SIK;JEONG, HYUNG SU
分类号 H03K19/173;H01L21/82 主分类号 H03K19/173
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