LOW-HARDNESS THERMALLY CONDUCTIVE RESIN COMPOSITION AND SHEET-FORM RADIATING MEMBER MADE THEREFROM

摘要

A low-hardness thermally conductive resin composition which is a non-silicone thermally conductive composition having excellent flexibility although a filler is contained therein in a large amount. It is suitable for use in various applications where thermal conductivity is required. The low-hardness thermally conductive resin composition is characterized by comprising (A) one or more polyol compounds comprising (a-1) 10-100 mass% product of the hydrogenation of a hydroxylated polyisoprene and (a-2) 90-0 mass% product of the hydrogenation of a hydroxylated polybutadiene, (B) at least one thermally conductive filler selected among metal hydroxides, metal oxides, and metal nitrides, and (C) a hardener, the amount of the ingredient (B) being 100-5,000 parts by mass per 100 parts by mass of the ingredient (A) and the amount of the ingredient (C) being such that the molar ratio of the reactive groups as the hardener in the ingredient (C) to the hydroxy groups contained in the ingredient (A) is 0.5-2.5.