发明名称 METHODS FOR FORMING SEMICONDUCTOR STRUCTURES WITH BURIED ISOLATION COLLARS AND SEMICONDUCTOR STRUCTURES FORMED BY THESE METHODS
摘要 A semiconductor structure including a trench formed in a substrate and a buried isolation collar that extends about sidewalls of the trench. The buried isolation collar is constituted by an insulator formed from a buried porous region of substrate material. The porous region is formed from a buried doped region defined using masking and ion implantation or by masking the trench sidewalls and using dopant diffusion. Advantageously, the porous region is transformed to an oxide insulator by an oxidation process. The semiconductor structure may be a storage capacitor of a memory cell further having a buried plate about the trench and a capacitor node inside the trench that is separated from the buried plate by a node dielectric formed on the trench sidewalls.
申请公布号 US2008220586(A1) 申请公布日期 2008.09.11
申请号 US20080125357 申请日期 2008.05.22
申请人 INTERNATIONAL BUSINESS MACHINES CORPORATION 发明人 CHENG KANGGUO;MANDELMAN JACK ALLAN
分类号 H01L21/762 主分类号 H01L21/762
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