| 摘要 |
PROBLEM TO BE SOLVED: To perform resin sealing of high quality by accurately and easily calculating the amount of resin necessary for the sealing. SOLUTION: A resin sealing method is disclosed for sealing a semiconductor chip mounted on a substrate 20, and the resin sealing method includes: an arrangement process of arranging the substrate 200 mounted with the semiconductor chip 202 in a predetermined closed space; a state changing process of changing gas present in the closed space M from a first state to a second state; a measuring process of measuring an amount of change made through the state changing process; and a calculating process of calculating the amount of resin to be fed into a metal mold based upon the measured change, the resin sealing is performed through the processes. COPYRIGHT: (C)2009,JPO&INPIT |
