| 摘要 |
PROBLEM TO BE SOLVED: To improve reliability of a circuit module by improving heat release performance and minimizing thermal effect on a device to be mounted as much as possible. SOLUTION: A base substrate 1B having a first substrate 1A mounted thereon is fitted into a lower portion of casing member 3, and a second substrate 2 is installed in the upper portion of the casing member so that a spaced area 26 can be provided. In addition, a drive device 31 to be installed on the second substrate 2 is positioned off the center of the second substrate 2. COPYRIGHT: (C)2009,JPO&INPIT |
