发明名称 |
SUBSTRATE TREATMENT DEVICE |
摘要 |
PROBLEM TO BE SOLVED: To provide a substrate treatment device capable of monitoring a data receiving condition. SOLUTION: The substrate treatment device comprises: a plurality of device side modules A-Z provided on a semiconductor manufacturing device for transmitting/receiving data; a monitoring module to be communicated with the device side modules A-Z; and communication programs incorporated in the device side modules and the monitoring module for communicating data between each of the device side modules A-Z and the monitoring module. The communication program for the monitoring module monitors receiving intervals for the data received by the deice side modules A-Z and determines whether the data is normally received or not. COPYRIGHT: (C)2009,JPO&INPIT
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申请公布号 |
JP2009088314(A) |
申请公布日期 |
2009.04.23 |
申请号 |
JP20070257198 |
申请日期 |
2007.10.01 |
申请人 |
HITACHI KOKUSAI ELECTRIC INC |
发明人 |
MAKINO NOBUHISA;KOYAMA YOSHITAKA |
分类号 |
H01L21/02;H01L21/22;H01L21/31 |
主分类号 |
H01L21/02 |
代理机构 |
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