LIGHT EMITTING DEVICE

摘要

Provided is a light emitting device wherein generation of voids in a bonding section between an LED chip and a metal layer arranged on an insulating base material is suppressed and a short-circuit between the LED chips is eliminated while reducing an interval between the adjacent LED chips. The light emitting device is provided with a plurality of LED chips (10), and one insulating base material (sub-mount member) (30) which is formed of an insulating material and has a plurality of LED chips (10) mounted thereon. The insulating base material (30) is provided with placing bases for mounting the LED chips (10), respectively, and on each placing base, a metal layer (31) to which the LED chip (10) is to be bonded by solder is formed. A groove (34) is formed between the adjacent placing bases, and a solder guiding section (32), which is composed of a material having solder wettability higher than that of the placing base, is formed on a side surface of the placing base.