发明名称 POLISHING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a polishing device for polishing a peripheral edge of a substrate and forming a right-angle cross sectional shape.SOLUTION: A polishing device comprises: a substrate holding unit 3 for holding a substrate W and rotating it; plural guide rollers 84D, 84E for supporting a polishing tape 38; and a polishing head 50 having a press member for pressing an edge of the polishing tape 38 from an upper side to the peripheral edge of the substrate W. The plural guide rollers 84D, 84E are arranged so that the polishing tape 38 extends in parallel to a tangential direction of the substrate W, and the polishing surface of the polishing tape 38 is parallel to the surface of the substrate W. The polishing head 50 has a tape stopper 185 for limiting horizontal movement of the polishing tape 38, and the tape stopper 185 is disposed on an outer side of the polishing tape 38 in a radial direction of the substrate W.SELECTED DRAWING: Figure 43
申请公布号 JP2016106037(A) 申请公布日期 2016.06.16
申请号 JP20160024688 申请日期 2016.02.12
申请人 EBARA CORP 发明人 SEKI MASAYA;TOGAWA TETSUJI;NAKANISHI MASAYUKI;MATSUDA NAOKI;YOSHIDA ATSUSHI
分类号 B24B21/00;B24B9/00;B24B21/18 主分类号 B24B21/00
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