发明名称 |
Thermally-Conductive Polycarbonate Resin Composition and Molded Product Formed Therefrom |
摘要 |
The present invention relates to a thermally conductive polycarbonate resin composition comprising (A) a polycarbonate resin, (B) a thermally conductive filler, (C) a modified polyolefin-based copolymer and (D) a low-molecular-weight polyolefin-based resin, thereby simultaneously exhibiting high impact strength, improving thermal conductivity and mechanical properties such as tensile strength and elongation, and having an excellent extrusion molding property. |
申请公布号 |
US2016200957(A1) |
申请公布日期 |
2016.07.14 |
申请号 |
US201314912963 |
申请日期 |
2013.12.02 |
申请人 |
SAMSUNG SDI CO., LTD. |
发明人 |
KIM Nam Hyun;SHIN Chan Gyun;JEON Byung Kuk;LIM Jong Cheol |
分类号 |
C09K5/14;C08L69/00 |
主分类号 |
C09K5/14 |
代理机构 |
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代理人 |
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主权项 |
1. A thermally conductive polycarbonate resin composition, comprising: (A) a polycarbonate resin, (B) thermally conductive fillers, (C) a modified polyolefin copolymer, and (D) a low molecular weight polyolefin resin. |
地址 |
Yongin-si, Gyeonggi-do KR |