发明名称 Thermally-Conductive Polycarbonate Resin Composition and Molded Product Formed Therefrom
摘要 The present invention relates to a thermally conductive polycarbonate resin composition comprising (A) a polycarbonate resin, (B) a thermally conductive filler, (C) a modified polyolefin-based copolymer and (D) a low-molecular-weight polyolefin-based resin, thereby simultaneously exhibiting high impact strength, improving thermal conductivity and mechanical properties such as tensile strength and elongation, and having an excellent extrusion molding property.
申请公布号 US2016200957(A1) 申请公布日期 2016.07.14
申请号 US201314912963 申请日期 2013.12.02
申请人 SAMSUNG SDI CO., LTD. 发明人 KIM Nam Hyun;SHIN Chan Gyun;JEON Byung Kuk;LIM Jong Cheol
分类号 C09K5/14;C08L69/00 主分类号 C09K5/14
代理机构 代理人
主权项 1. A thermally conductive polycarbonate resin composition, comprising: (A) a polycarbonate resin, (B) thermally conductive fillers, (C) a modified polyolefin copolymer, and (D) a low molecular weight polyolefin resin.
地址 Yongin-si, Gyeonggi-do KR