| 摘要 |
A bonded structure having a bonding area in which a metal member and a resin member are bonded. A recessed section having an opening in the surface of the metal member is formed in a bonding area in the metal member, the resin member is filled into the recessed section in the metal member, and a thin section in which the thickness of the metal member is reduced is provided in an area in the metal member, said area including the bonding area and an adjacent area that is adjacent to the bonding area. |
