Solid-state drive with passive heat transfer

摘要

The disclosed embodiments relate to a system that facilitates thermal conductance in a system that includes a module comprising a circuit board with integrated circuits, such as a solid-state drive. A thermal-coupling material between one side of the circuit board and an adjacent baseplate is used to increase thermal conduction between the circuit board and the baseplate. Furthermore, the module may include another thermal-coupling material between the baseplate and a housing that at least in part surrounds the circuit board, thereby increasing thermal conduction between the baseplate and the housing. In these ways, the baseplate and/or the housing may be used as a heat-transfer surfaces or heat spreaders that reduce hotspots associated with operation of the integrated circuits.

主权项

1. A module, comprising: a housing; a circuit board having an integrated circuit disposed on a surface of the circuit board; a baseplate mechanically coupled to an edge of the circuit board; a thermal-coupling material that: is positioned between and contacts the integrated circuit, and the baseplate, and directly contacts the circuit board, wherein the thermal-coupling material provides for thermal conductance between the circuit board and the baseplate; and a secondary thermal-coupling material disposed between and directly contacting the housing and the baseplate.