Antenna array feeding structure having circuit boards connected by at least one solderable pin

摘要

Systems and methods for a feeding structure for an antenna array are provided. In at least one embodiment, the feeding structure for an antenna array comprises one or more circuit boards with one or more circuits formed thereon, one or more conductive layers wherein the one or more circuit boards are mounted to the one or more conductive layers, and one or more connectors coupled to the one or more circuits through an opening in the one or more conductive layers. Furthermore, the one or more conductive layers are separated by a dielectric from the one or more circuits and the one or more conductive layers contact the one or more circuit boards such that the one or more circuits are isolated from the one or more conductive layers.

主权项

1. A method for constructing a feeding structure for an antenna array comprising:
providing a first circuit board,
wherein a first circuit is formed on the first circuit board; providing a second circuit board,
wherein a second circuit is formed on the second circuit board; mounting the first and second circuit boards between different conductive layers in a plurality of conductive layers,
wherein the plurality of conductive layers are separated by a dielectric from the first and second circuits and the conductive layers in the plurality of conductive layers that contact the first and second circuit boards such that the first and second circuits are isolated from the plurality of conductive layers; andwherein at least one solderable pin connects the first circuit board to the second circuit board through at least one opening in a middle conductive layer in the plurality of conductive layers; and coupling a plurality of connectors to the first circuit through a plurality of openings in an external conductive layer in the plurality of conductive layers.