| 发明名称 | Electrostatic discharge protection device and chip component with the same | ||
| 摘要 | Disclosed herein is an electrostatic discharge protection device including: a lower cover; electrodes disposed on the lower cover, being spaced apart from each other; a conductor disposed on the lower cover; and a semiconducting material layer covering the lower cover and the electrodes and formed of a semiconducting material. | ||
| 申请公布号 | US9408285(B2) | 申请公布日期 | 2016.08.02 |
| 申请号 | US201414148255 | 申请日期 | 2014.01.06 |
| 申请人 | SAMSUNG ELECTRO-MECHANICS CO., LTD. | 发明人 | Lee Hong Ryul;Min Kyong Bok;Wi Sung Kwon |
| 分类号 | H05F3/00;H05F3/02;H01H47/00;H05F3/04;H01L23/60;H02H9/00 | 主分类号 | H05F3/00 |
| 代理机构 | McDermott Will & Emery LLP | 代理人 | McDermott Will & Emery LLP |
| 主权项 | 1. An electrostatic discharge protective device, comprising: a lower cover; electrodes disposed on the lower cover, being spaced apart from each other; a conductor; and a semiconducting material layer covering the lower cover and the electrodes and formed of a semiconducting material, wherein the semiconducting material includes at least any one of polyacetylene, poly (p-phenylene) (PPP), polypyrrole (PYR), and polyazine (PAZ), and the conductor is distributed within the semiconducting material layer and separated from a boundary surface between the lower cover and the semiconducting material layer. | ||
| 地址 | Suwon, Gyunggi-Do KR | ||