发明名称 Microphone package with embedded ASIC
摘要 A packaged microphone has a base, a lid coupled to the base forming an interior, a MEMS microphone secured to the base within the interior, and an integrated circuit embedded in the base. Apertures in the base and integrated circuit are aligned to form an aperture from the exterior of the package to the interior.
申请公布号 US9407997(B2) 申请公布日期 2016.08.02
申请号 US201113272045 申请日期 2011.10.12
申请人 INVENSENSE, INC. 发明人 Delaus Michael D.;O'Donnell Kathy;Goida Thomas M.
分类号 H04R25/00;H04R19/00;B81C1/00;H04R19/04 主分类号 H04R25/00
代理机构 IPxLaw Group LLP 代理人 Imam Maryam;IPxLaw Group LLP
主权项 1. A microphone carrier comprising: laminate base having an aperture extending through the laminate base uninterrupted; a microphone comprising: a microphone substrate disposed on top of the laminate base and comprising a backside cavity;a diaphragm suspended from the microphone substrate and spanning the backside cavity; an integrated circuit chip (IC) comprising a first IC chip side and a second IC chip side, and an IC chip aperture disposed between the first IC chip side and the second IC chip side, the IC chip being embedded in the laminate base, in its entirety, and the IC chip aperture being aligned with the aperture extending through the laminate base uninterrupted so as to allow audio signals to enter the aligned IC aperture and the aperture.
地址 San Jose CA US