| 摘要 |
PROBLEM TO BE SOLVED: To provide a chip delivery jig and a chip delivery method, capable of delivery in a shorter tact time with no deformation of a solder bump of semiconductor chip under contact even if there exists variation in chip delivery positions which is caused by expansion/contraction under heat along lifting direction of a bonding head, relating to delivery of a semiconductor chip between a chip transport device such as a chip slider and a bonding head.SOLUTION: A chip delivery jig is provided which is equipped with a gap regulation means for regulating a gap between a semiconductor chip and a bonding head, on the outer peripheral side of a semiconductor chip end face mounted on a chip transport device. Further, a delivery method is provided in which, on a lower side of the bonding head, a gap between a lower surface of the bonding head and an upper surface of the semiconductor chip is kept at a predetermined interval. In the middle of cooling of the bonding head on the way from a solder melting temperature to a preheating temperature, the semiconductor chip is delivered from a chip transport means to the bonding head. |
