SILICON WAFER FABRICATION METHOD USING O2 PLASMA

摘要

PURPOSE: A method for removing organic contaminants using oxygen plasma and a method for manufacturing a silicon wafer for a solar cell are provided to reduce manufacturing costs by using silicon oxide layer generates in an oxygen plasma process as a mask in a texturing process. CONSTITUTION: A wafer is cut(S-11). Organic contaminants are removed from the surface of the wafer by applying oxygen plasma to the surface of the cut wafer(S-12). A texturing process is performed by using an oxide layer on the surface of the wafer generated in an oxygen plasma process(S-13). [Reference numerals] (S-11) Wafer cutting step; (S-12) Oxygen plasma processing step; (S-13) Texturing step