| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a mount board and a light emitting module which improve heat radiation performance. <P>SOLUTION: A mount board 2 includes: a heat exchanger plate 21 formed by a metal plate and allowing an electronic component to be mounted on one surface side; a wiring board 22 in which a wiring pattern 22b that may electrically connect with the electronic component is provided on one surface of an organic insulation substrate 22a, and which is disposed on the other side of the heat exchanger plate 21; and an insulation layer 23 disposed between the heat exchanger plate 21 and the wiring board 22. Through holes 21b, exposing a connection portion of the electronic component in the wiring pattern 22b, are formed in the heat exchanger plate 21. In the mount board 2, the plane size of the wiring board 22 is larger than the plane size of the heat exchanger plate 21, and the wiring pattern 22b of the wiring board 22 extends to a region that does not overlap with the heat exchanger plate 21. A light emitting module is formed with a solid light emitting element mounted on the mount board 2 as the electronic component. <P>COPYRIGHT: (C)2013,JPO&INPIT |
