Process for mounting a semiconductor device

摘要

The process for producing a semiconductor device according to the invention comprises a pre-sticking/fixing step of pre-sticking/fixing a semiconductor element (13) through an adhesive sheet (12) to an object (11) to which the semiconductor element (13) is to be stuck/fixed, and a wire (16) bonding step of performing wire (16) bonding without a heating step, wherein the shear adhesive force of the adhesive sheet (12) to the object (11) is 0.2 MPa or more at the time of the pre-sticking/fixing. This makes it possible to provide a semiconductor device producing process wherein a drop in the yield of semiconductor devices is suppressed and steps therein are made simple; wherein an adhesive sheet (12) is used in this process, and a semiconductor device obtained by the process.