| 摘要 |
The invention relates to an electronic appliance and a method for producing an electronic appliance comprising semiconductors (l) and a cooling body (31) for heat dissipation to the surrounding environment or another medium. A highly heat-conductive part (24) is arranged on the cooling body (31), especially for conducting the heat of the semiconductor to the cooling body. According to the invention, a printed circuit board (23) is provided with semiconductors, cooling surfaces (2) of the semiconductors being applied to a partial region (21) of the printed circuit board, especially for adjustment purposes; the partial region (21) of the printed circuit board is broken off and/or removed; and the printed circuit board is connected, especially detachably connected, to the cooling body in such a way that the cooling surfaces (2) are applied to the highly conductive part (24) in an especially plane manner. |
