| 摘要 |
PROBLEM TO BE SOLVED: To provide a die bonder device improving transferring efficiency and mounting efficiency of a semiconductor chip. SOLUTION: This die bonder device includes a bonding head 21 movable in XYZ directions, a pushing-up unit 25 and an XY table stage 34. The bonding head includes a bonding head axis 22 movable in XY directions, a plurality of collet holders 23 fixed to the bonding head axis, and a plurality of collets 23. The pushing-up unit includes a ring-like sheet 28 on which a wafer comprising a plurality of semiconductor chips is pasted, a ring 29 arranged on the outside of the wafer on the sheet, and a pin holder 31 having a pushing-up pin for pushing up the semiconductor chip. The XY table stage has a function of moving in the XY directions. A specific semiconductor chip is pushed up by the pushing-up pin of the pushing-up unit to suck the semiconductor chip with the collet and then transfer it to a lead frame for mounting. COPYRIGHT: (C)2009,JPO&INPIT |
