| 摘要 |
A substrate processing apparatus (1) includes a bath body (11), cover members (12), processing liquid nozzles (31) for ejecting an SPM liquid like a shower, and gas nozzles (32) for ejecting nitrogen gas. The processing liquid nozzles eject a processing liquid (91) onto substrates (9) from sidewalls (111) of the bath body (11). By ejecting gas toward lower surfaces of the cover members from the gas nozzles before the substrates are loaded into the bath body, it is possible to remove droplets of the processing liquid deposited on the lower surfaces of the cover members during the previous processing of the substrates or during a temperature control where the processing liquid is ejected from the processing liquid nozzles. It is thereby possible to prevent or reduce deposition of droplets of the processing liquid dropped onto the substrates immediately after being loaded into the bath body. |
