CERAMIC SUBSTRATE, BONDED BODY, MODULE, AND CERAMIC SUBSTRATE MANUFACTURING METHOD

摘要

This ceramic substrate has a ceramic as a main constituent material, and has a first main surface (10A), and a second main surface (10B) that is positioned on the reverse side of the first main surface (10A). In the second main surface (10B), a recessed section (1) recessed to the first main surface (10A) side is formed. A wiring section (5) extending from an outer peripheral surface of the ceramic substrate (10) to the inside of the recessed section (1) is formed, and a bottom section (2) of the recessed section (1), said bottom section being positioned on the first main surface (10A) side, has a thin portion compared with other portions of the ceramic substrate (10), said other portions excluding the bottom section (2).