| 摘要 |
In this substrate processing device (1), a cup part (4) is moved in the vertical direction, and a cup exhaust port (i.e. one from among a first cup exhaust port (421) and a second cup exhaust port (422)) is selectively made to overlap a first chamber exhaust port (631) or a second chamber exhaust port (632). While the cup exhaust port is in a state of overlapping the first chamber exhaust port (631), gas inside the cup part (4) is discharged to the exterior of a chamber (6) through the cup exhaust port and the first chamber exhaust port (631) by a first exhaust mechanism (951). Furthermore, while the cup exhaust port is in a state of overlapping the second chamber exhaust port (632), the gas inside the cup part (4) is discharged to the exterior of the chamber (6) through the cup exhaust port and the second chamber exhaust port (632) by a second exhaust mechanism (952). As a result, the exhaust mechanism which discharges exhaust from the cup part (4) can be easily switched between the first exhaust mechanism (951) and the second exhaust mechanism (952). |
