| 摘要 |
The purpose of the invention is to improve the waterproofing effect in an electronic device. Disclosed is an electronic device 300A comprising an electronic component 315, 320 and an epoxy resin part 348 that seals the electronic component, the electronic device being arranged in a cooling medium 121 that cools the electronic component, wherein a first layer 602 having a three-dimensional crosslinked structure is formed on a surface of, or in the interior of, the epoxy resin part 348. The first layer 602 is formed such that a length calculated by the cube root of the average free volume of the three-dimensional crosslinked structure of the first layer is shorter than the length of the longest side of a molecule constituting the cooling medium. |
