INTEGRATION OF AN UNPROCESSED, DIRECT-BANDGAP CHIP INTO A SILICON PHOTONIC DEVICE

摘要

A composite device for splitting photonic functionality across two or more materials comprises a platform, a chip, and a bond securing the chip to the platform. The platform comprises a base layer and a device layer. The device layer comprises silicon and has an opening exposing a portion of the base layer. The chip, a material, comprises an active region (e.g., gain medium for a laser). The chip is bonded to the portion of the base layer exposed by the opening such that the active region of the chip is aligned with the device layer of the platform. A coating hermetically seals the chip in the platform.

主权项

1. A composite device for splitting photonic functions across two or more materials, the composite device comprising:
a platform, the platform comprising:
a base layer;a device layer, wherein:
the device layer comprises a first material;the first material is a semiconductor; andthe device layer comprises a plurality of walls forming an opening in the device layer; a chip, wherein:
the chip comprises an active region; andthe active region comprises a second material; a bond securing the chip to the platform, wherein:
the chip is secured to the base layer of the platform in the opening of the device layer; andthe device layer of the platform is optically aligned with the active region of the chip; and a coating, wherein the coating hermetically seals the chip in the platform.