| 发明名称 | Low magnetic chemical mechanical polishing conditioner | ||
| 摘要 | The present invention relates to a low magnetic chemical mechanical polishing conditioner and a method for producing the same. The method comprises: providing a substrate; providing a bonding layer disposed on the substrate; and providing a plurality of abrasive particles placed on the bonding layer, and the abrasive particles are placed on the substrate by the bonding layer; wherein the abrasive particles are screened into a non-magnetic content or a low magnetic content through a magnetic separation device. Therefore, the abrasive particles used in the low magnetic chemical mechanical polishing conditioner of the present invention are non-magnetic abrasive particles perfectly to avoid influence of polishing performance due to magnetic abrasive particles. | ||
| 申请公布号 | US9475171(B2) | 申请公布日期 | 2016.10.25 |
| 申请号 | US201414561022 | 申请日期 | 2014.12.04 |
| 申请人 | KINIK COMPANY | 发明人 | Wu Tian-Yeu |
| 分类号 | B24B53/00;B24B53/017;B03C1/033;B03C1/12;B03C1/16 | 主分类号 | B24B53/00 |
| 代理机构 | Muncy, Geissler, Olds & Lowe, P.C. | 代理人 | Muncy, Geissler, Olds & Lowe, P.C. |
| 主权项 | 1. A method for manufacturing a low magnetic chemical mechanical polishing conditioner, comprising: providing a substrate; providing a binding layer disposed on a surface of the substrate; and providing a plurality of abrasive particles embedded in the binding layer and fixed to the substrate by the binding layer; wherein the abrasive particles are screened into a non-magnetic content or a low magnetic content through a magnetic separation device, wherein the non-magnetic content means a number percentage of magnetic abrasive particles to be 0, and the low magnetic content means a number percentage of magnetic abrasive particles to be 0.1 to 5.0. | ||
| 地址 | Taipei TW | ||