| 发明名称 |
METHOD FOR METALIZING POLYMER SUBSTRATE AND POLYMER ARTICLE PREPARED THEREOF |
| 摘要 |
A method for metalizing a polymer substrate and a polymer article prepared thereof. First, a polymer substrate having a base polymer and at least one metal compound dispersed in the base polymer is provided. Then, a surface of the polymer substrate is irradiated with an energy beam such that a water contact angle of the surface of the polymer substrate is at least 120°. The surface of the polymer substrate is then subjected to chemical plating. |
| 申请公布号 |
US2016333481(A1) |
申请公布日期 |
2016.11.17 |
| 申请号 |
US201615217730 |
申请日期 |
2016.07.22 |
| 申请人 |
BYD COMPANY LIMITED |
发明人 |
Gong Qing;Zhou Wei;Sun Yongliang |
| 分类号 |
C23C18/18;C23C18/40;C23C18/16 |
主分类号 |
C23C18/18 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method for metalizing a polymer substrate, comprising:
providing a polymer substrate having a base polymer and at least one metal compound dispersed in the base polymer, the base polymer comprising a polymer, wherein the metal compound has a formula selected from one of the following formulas (CuaM11-a)3(PO4)2 (I), (CubM21-b)2(OH)PO4 (II), and (CucM31-c)2P2O7 (III), where M1 comprises at least one element selected from group IIA of periodic table of elements, 0<a≦1; M2 comprises at least one element selected from group IIA of periodic table of elements, 0<b≦1; and M3 comprises at least one element selected from group IIA of periodic table of elements, 0<c≦1; irradiating a surface of the polymer substrate with an energy beam such that a water contact angle of the surface of the polymer substrate is at least 120°; and performing chemical plating on the surface of the polymer substrate. |
| 地址 |
Shenzhen CN |
