发明名称 STATE MONITORING METHOD FOR PLASMA PROCESSING APPARATUS, AND STATE MONITORING STRUCTURE FOR PLASMA PROCESSING APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a state monitoring method for a plasma processing apparatus and a state monitoring structure for a plasma processing apparatus that achieve a simple configuration and that can monitor a state of the plasma processing apparatus comprehensively.SOLUTION: A state monitoring structure 1, as one example of a state monitoring structure for a plasma processing apparatus, to which the present invention is applied, comprises: an RF power supply 2; a directional coupler 3; oscillation measurement means 4; an automatic matching circuit 5; and a process chamber 6. The plasma processing apparatus has the process chamber 6 as a plasma processing chamber. Plasma is formed in the process chamber 6, and etching processing is performed on a semiconductor wafer arranged in the chamber.SELECTED DRAWING: Figure 1
申请公布号 JP2016197495(A) 申请公布日期 2016.11.24
申请号 JP20150075875 申请日期 2015.04.02
申请人 NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY 发明人 KASAJIMA YUJI;UESUGI FUMIHIKO
分类号 H05H1/46;C23C16/52;H01L21/3065 主分类号 H05H1/46
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