发明名称 |
STATE MONITORING METHOD FOR PLASMA PROCESSING APPARATUS, AND STATE MONITORING STRUCTURE FOR PLASMA PROCESSING APPARATUS |
摘要 |
PROBLEM TO BE SOLVED: To provide a state monitoring method for a plasma processing apparatus and a state monitoring structure for a plasma processing apparatus that achieve a simple configuration and that can monitor a state of the plasma processing apparatus comprehensively.SOLUTION: A state monitoring structure 1, as one example of a state monitoring structure for a plasma processing apparatus, to which the present invention is applied, comprises: an RF power supply 2; a directional coupler 3; oscillation measurement means 4; an automatic matching circuit 5; and a process chamber 6. The plasma processing apparatus has the process chamber 6 as a plasma processing chamber. Plasma is formed in the process chamber 6, and etching processing is performed on a semiconductor wafer arranged in the chamber.SELECTED DRAWING: Figure 1 |
申请公布号 |
JP2016197495(A) |
申请公布日期 |
2016.11.24 |
申请号 |
JP20150075875 |
申请日期 |
2015.04.02 |
申请人 |
NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY |
发明人 |
KASAJIMA YUJI;UESUGI FUMIHIKO |
分类号 |
H05H1/46;C23C16/52;H01L21/3065 |
主分类号 |
H05H1/46 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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