发明名称 |
METHOD OF MANUFACTURING MULTILAYER CERAMIC ELECTRONIC COMPONENT |
摘要 |
A method of manufacturing a multilayer ceramic electronic component includes preparing a green mother laminate in which ceramic layers and inner electrode layers are stacked; cutting the mother laminate perpendicularly or substantially perpendicularly to a main surface of the mother laminate and in a first direction when the mother laminate is viewed in plan such that first sectional surfaces are formed, and pressing the mother laminate to obtain a bonded laminate in which the first sectional surfaces are bonded to each other; and separating the bonded laminate between the first sectional surfaces to obtain laminates. Then, the bonded laminate is cut perpendicularly or substantially perpendicularly to the main surface and in a second direction that intersects the first sectional surfaces such that second sectional surfaces are formed. |
申请公布号 |
US2016351334(A1) |
申请公布日期 |
2016.12.01 |
申请号 |
US201615158691 |
申请日期 |
2016.05.19 |
申请人 |
Murata Manufacturing Co., Ltd. |
发明人 |
TAKAGI Yuya;MATSUI Togo;OKUDA Hikaru |
分类号 |
H01G4/30;H01G13/00 |
主分类号 |
H01G4/30 |
代理机构 |
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代理人 |
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主权项 |
1. A method of manufacturing a multilayer ceramic electronic component, the method comprising:
a bonded laminate forming step including:
cutting a green mother laminate, in which ceramic layers and inner electrode layers are stacked, to form first sectional surfaces that intersect a main surface of the green mother laminate; andafter cutting, pressing the cut green mother laminate to obtain the bonded laminate in which the first sectional surfaces are bonded to each other; and a separating step of separating the bonded laminate between the first sectional surfaces, which have been bonded to each other, to obtain separated laminates. |
地址 |
Nagaokakyo-shi JP |