发明名称 METHOD OF MANUFACTURING MULTILAYER CERAMIC ELECTRONIC COMPONENT
摘要 A method of manufacturing a multilayer ceramic electronic component includes preparing a green mother laminate in which ceramic layers and inner electrode layers are stacked; cutting the mother laminate perpendicularly or substantially perpendicularly to a main surface of the mother laminate and in a first direction when the mother laminate is viewed in plan such that first sectional surfaces are formed, and pressing the mother laminate to obtain a bonded laminate in which the first sectional surfaces are bonded to each other; and separating the bonded laminate between the first sectional surfaces to obtain laminates. Then, the bonded laminate is cut perpendicularly or substantially perpendicularly to the main surface and in a second direction that intersects the first sectional surfaces such that second sectional surfaces are formed.
申请公布号 US2016351334(A1) 申请公布日期 2016.12.01
申请号 US201615158691 申请日期 2016.05.19
申请人 Murata Manufacturing Co., Ltd. 发明人 TAKAGI Yuya;MATSUI Togo;OKUDA Hikaru
分类号 H01G4/30;H01G13/00 主分类号 H01G4/30
代理机构 代理人
主权项 1. A method of manufacturing a multilayer ceramic electronic component, the method comprising: a bonded laminate forming step including: cutting a green mother laminate, in which ceramic layers and inner electrode layers are stacked, to form first sectional surfaces that intersect a main surface of the green mother laminate; andafter cutting, pressing the cut green mother laminate to obtain the bonded laminate in which the first sectional surfaces are bonded to each other; and a separating step of separating the bonded laminate between the first sectional surfaces, which have been bonded to each other, to obtain separated laminates.
地址 Nagaokakyo-shi JP
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