发明名称 |
Fixed abrasive article for use in modifying a semiconductor wafer |
摘要 |
An abrasive article that includes a fixed abrasive element having a plurality of abrasive particles, a resilient element, and a plurality of rigid segments disposed between the fixed abrasive element and the resilient element.
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申请公布号 |
US2002111120(A1) |
申请公布日期 |
2002.08.15 |
申请号 |
US20010784667 |
申请日期 |
2001.02.15 |
申请人 |
3M INNOVATIVE PROPERTIES COMPANY |
发明人 |
GOETZ DOUGLAS P. |
分类号 |
B24B37/00;B24B37/04;B24D3/00;B24D13/12;B24D13/14;H01L21/304;(IPC1-7):B24B1/00;B24D11/00 |
主分类号 |
B24B37/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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