发明名称 Semiconductor integrated circuit (IC) packaging with carbon nanotubes (CNT) to reduce IC/package stress
摘要 A packaged integrated circuit (IC) is described having an integrated circuit that is electrically coupled to its package's wiring with Carbon nanotubes (CNTs) placed within an electrically conductive material.
申请公布号 US2006220198(A1) 申请公布日期 2006.10.05
申请号 US20050095856 申请日期 2005.03.30
申请人 发明人 BASKARAN RAJASHREE
分类号 H01L23/495 主分类号 H01L23/495
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