| 摘要 |
Equipment for fabricating a semiconductor device is provided to solve a problem in that pressure difference between one chamber and another chamber, to which a wafer is transferred, is produced. A process for a wafer is performed in plural process chambers(118,120,122,124). A transfer chamber(130) transfers the wafer from load lock chambers(110,112) to the process chamber, and transfers the processed wafer from the process chamber to the load lock chamber. Internal pressure of process chambers is maintained to a predetermined level by a purge unit. When a slit valve interposed between a first process chamber and a second process chamber is opened, the purge unit adjusts the process chambers so that a difference of the internal pressure of the first and the second process chambers is decreased.
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