| 摘要 |
PROBLEM TO BE SOLVED: To provide a conductive substrate capable of using a material having low heat resistance as a base material, and having a practically satisfactory conductivity and high adhesion between the base material and a conductive thin film. SOLUTION: This conductive substrate is a conductive substrate having a conductive thin film on a base material and is characterized in that metal fine particles are fusion-bonded to at least the outermost surface of the conductive thin film and at least in a face of the conductive thin film which is contacted with the base material, fine particles maintain a particle shape. COPYRIGHT: (C)2009,JPO&INPIT
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