发明名称 基板処理方法、前処理装置、後処理装置、基板処理システムおよび記憶媒体
摘要 PROBLEM TO BE SOLVED: To enhance productivity.SOLUTION: A substrate processing method includes a pretreatment step, a process liquid supply step, and a housing step. The pretreatment step performs pretreatment, requiring atmosphere management or time management after treatment, for a substrate. The process liquid supply step supplies process liquid, containing a volatile component and forming a film on the substrate, to the substrate after the pretreatment step. The housing step houses a substrate, where the process liquid has solidified or hardened due to evaporation of the volatile component, in a transport container.
申请公布号 JP5937632(B2) 申请公布日期 2016.06.22
申请号 JP20140021599 申请日期 2014.02.06
申请人 東京エレクトロン株式会社 发明人 菅野 至;金子 都;折居 武彦
分类号 H01L21/304;H01L21/02;H01L21/3065 主分类号 H01L21/304
代理机构 代理人
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